Design Lead (TW)

HCL Technologies
HCL Technologies

Design

Posted on Sep 7, 2026

Job Summary

Eligibility Criteria

  • Diploma / Degree in Electrical / Electronics / Mechanical / Mechatronics or related technical discipline
  • 3–6 years of experience in Semiconductor FAB / Equipment Engineering / Field Service
  • Hands-on experience in tool installation & start-up activities
  • Good English communication skills (spoken & written)
  • Willingness to work in cleanroom / fab environments and global project sites

Key Responsibilities

  • Strong understanding of:
    • Semiconductor equipment modules (any one or more): Lithography / Dry Etch / Thin Film / Diffusion / Metrology / Wet
    • Tool start-up procedures as per OEM guidelines
    • Electromechanical systems and control logic
  • Hands-on experience in:
    • Tool power-up and initialization sequences
    • Hardware functional checks and subsystem verification
    • Handler & wafer transfer system validation
  • Working knowledge of:
    • Sensors, actuators, PLC basics, interlocks
    • Utility systems (Electrical, Gas, Vacuum, CDA, Chilled water)
  • Ability to:
    • Read schematics, P&IDs, wiring diagrams, and OEM manuals
    • Execute structured troubleshooting and fault isolation

Added Advantage:

  • Experience in Semiconductor wafer FAB environment
  • Exposure to OEM start-up checklists and qualification procedures
  • Understanding of process flow and tool integration in production line

Roles & Responsibilities

Tool Start-up & Commissioning

  • Execute tool start-up activities based on OEM-defined checklists
  • Perform safe power-up and system initialization of equipment
  • Verify equipment readiness prior to process qualification

Functional & Hardware Validation

  • Conduct comprehensive hardware functional checks, including:
    • Motion systems (robotics, stages, handler systems)
    • Sensors, actuators, interlocks and alarms
  • Validate core equipment modules for proper working condition
  • Ensure subsystem integration and communication readiness
  • Confirm utility stability and system response
  • Identify and resolve start-up related issues and faults
  • Perform root cause analysis for hardware or interface issues
  • Coordinate with OEM / senior engineers for complex failures

Subsystem Verification

  • Check and validate:
    • Wafer handling systems (robot, aligner, load port, EFEM)
    • Process chambers / modules readiness
    • Gas flow, vacuum, temperature, and pressure systems
  • Confirm utility stability and system response

Documentation & Compliance

  • Complete OEM checklists, reports, and start-up documentation
  • Maintain accurate logs of issues, fixes, and observations
  • Adhere strictly to:
    • EHS and cleanroom protocols
    • Customer site procedures and quality standards

Skill Requirements

Other Requirements